International Summer Program Understanding U.S. IP Law 

The Stanford Law, Science & Technology Program (LST) and its Transatlantic Technology Law Forum (TTLF) have a long-standing tradition of sharing its expertise in IP and tech law with lawyers from around the world. In an effort to further promote the understanding of the world’s IP law regimes, the TTLF has established an intensive two-week certificate program on U.S. IP law for international lawyers. This international summer program is co-directed by Prof. Siegfried Fina, Prof. Mark Lemley and Dr. Roland Vogl.

The summer program will provide a broad foundation in U.S. IP law with specific attention to high-tech IP issues. It will focus on the fundamental concepts of U.S. IP law and give practical insights into Silicon Valley’s high-tech industry. You will learn from Stanford’s world-renowned professors and Silicon Valley’s leading practitioners. Learn from their experience and expertise!

Bring your professional skills to the next level! The program will provide you a unique learning experience at a world leading law school in the heart of Silicon Valley. It will also offer you an opportunity to connect and network with top IP experts from Stanford and Silicon Valley. In addition to receiving a world-class education in IP law, participants will build lifetime friendships and professional connections with their fellow students.

Summer program participants receive a Stanford Law School Program Certificate.

The summer program covers topics such as

  • Introduction to U.S. IP Law
  • Copyright
  • Copyright and the internet
  • Trademarks: Brand protection in the U.S.
  • Trademarks on the internet
  • Patents
  • Trade secrets
  • Design protection
  • IP licensing and technology transfer
  • Venture capital in Silicon Valley
  • IP litigation
  • Silicon Valley company insights

In 2022, this international summer program will be held at Stanford Law School on August 22-26, 2022.

For more information and to register, please visit our summer program website.